| |
|
|
| |
中国半导体行业协会集成电路设计分会
2007年会暨自主创新与产业共赢论坛
会议日程 |
CSIA-ICCAD 2007 Annual Conference &
Independent Innovation and Industry Win-together Forum
Conference Agenda |
|
2007年10月11日，星期四
Oct.11st, Thursday
|
|
地点：大连香洲花园酒店三楼玫瑰厅
Site:Rose Hall，3rd FL, Dalian Sweetland Hotel
|
| |
|
时 间
Time
|
内 容
Contents
|
|
开 幕 式
Opening Ceremony
|
|
主持人：中国半导体行业协会集成电路设计分会常务副理事长魏少军教授
Moderator: Prof. Wei Shaojun, Managing Vice General Director of CSIA-ICCAD
|
| 08:30-08:45 |
中国半导体行业协会理事长俞忠钰先生致词
Opening Address, Mr. Yu Zhongyu, General Director of CSIA
大连市人民政府/辽宁省领导致欢迎词
Welcome Address, Dalian Municipal/ Liaoning Provincial
Government Officials
科技部领导讲话
Speech, Ministry of Science and Technology Official(MST)
信息产业部领导讲话
Speech, Ministry of Information Industry Official(MII)
|
| 08:45-09:15 |
创新是集成电路设计业永恒的旋律
—中国半导体行业协会集成电路设计分会理事长王芹生女士
Innovation is the everlasting rhythm of IC design industry
—Ms. Wang Qinsheng, General Director of CSIA-ICCAD
|
| 09:15-09:45 |
国家集成电路产业化基地---公共资源支持新兴产业发展的途径
—科技部原副部长马颂德先生
National IC industrial Base---The approach for publicresources to support new industry development
—Mr. Ma Songde, former Undersecretary of MST
|
| 09:45-10:15 |
主题报告
—信息产业部副部长娄勤俭先生
Theme Report
—Mr. Lou Qinjian, Vice Minister, MII
|
| 10:15-10:25 |
茶歇、参观展览Tea break, Exhibition Visit |
|
主 题 演 讲
Theme Presentations
|
| 10:25-10:50 |
在东北振兴中发挥龙头作用，做大做强集成电路产业
—大连市信息产业局局长江亲瑜先生
Bring into play a role of dragon head along with theopportunity of north east prospering to strengthen IC industry
—Mr. Jiang Qinyu, Director General, Dalian Municipal Government Information Industry Bureau
|
| 10:50-11:10 |
高速发展的大连高新技术园区
—大连高新技术产业园区副主任王咸进先生
Dalian High-tech Park developing rapidly
—Mr.Wang Xianjin, Vice Director, Dalian High-tech Park
|
| 11:10-11:35 |
推动产业，成就客户，支持IC产业自主创新
—Synopsys公司全球总裁兼首席运营官陈志宽博士
To promote industry and make customers succeed, to support IC industry self-innovation
—Dr. Chi-Foon Chan, Global President & COO, Synopsys
|
| 11:35-12:00 |
SOC供应之典范移转
—FSA亚太领袖议会成员石克强先生
Paradigm shift of SoC supply chain
—Mr. K.C. Shih, Leadership Council Member, FSA Asia-Pacific
|
| 12:00-13:30 |
自助午餐Buffet Lunch |
|
论 坛 报 告
Forum Presentation
|
|
主持人：中国半导体行业协会集成电路设计分会副理事长严晓浪教授
Moderator: Prof. Yan Xiaolang, Vice General Director of CSIA-ICCAD
|
| 13:30-13:55 |
构筑基于Star-IP的SoC平台
—芯原股份有限公司董事长兼总裁 戴伟民博士
Building Star-IP based SoC platforms
—Dr. Wayne Dai，Board Chairman & CEO, VeriSilicon Holdings Co., Ltd.
|
| 13:55-14:20 |
从制造，创新及应用看中国IC产业的发展
—TSMC公司中国业务发展副总经理 罗镇球先生
Talking about China’s IC industry from the point of viewing foundry, innovation and application
—Mr. Luo Zhenqiu, BD Vice GM, TSMC.
|
| 14:20-14:45 |
从中国IC设计企业的成长看消费类电子产业发展趋势
—炬力集成电路设计有限公司董事长 李湘伟先生
Talking about consumer electronics industry development trend from the point of viewing China’s IC design houses development
—Mr Li Xiangwei, Board Chairman, Actions Semiconductor Co., Ltd.
|
| 14:45-15:10 |
模拟工艺及加工能力演变
Analog technology & manufacturing evolution
—华润上华科技有限公司市场及销售副总 Mr. Gerry Fortin
—Mr. Gerry Fortin, VP of Marketing and Sales, CSMC Technologies Corporation
|
| 15:10-15:35 |
创新中国、服务世界——RF-ID发展之路
—北京同方微电子有限公司总裁 赵维健先生
Innovation in China, Serve the world--Evolution of RF-ID
—Mr. Zhao Weijian, President, Beijing Tongfang Microelectronics Company
|
| 15:35-15:50 |
茶歇、参观展览Tea break, Exhibition Visit |
| 15:50-16:15 |
中国IC设计企业的突破之路---全球->本土->全球
—展讯通信有限公司首席技术官 陈大同博士
Global->mainland->Global---The breakthrough way for China IC design houses
—Dr Chen Datong, CTO, Spreadtrum Communications Co., Ltd.
|
| 16:15-16:40 |
中国集成电路产业的人才需求与挑战
—INTEL公司技术培训部经理 张仲民
HR demands and challenges of China IC industry
—Mr Zhang Zhongmin, Technology Training Manager, Intel
|
| 16:40-17:05 |
数字视听产业与集成电路
—中国华录集团有限公司董事副总经理 韩建国先生
Digital Video & Audio industry and IC
—Mr. Han Jianguo, Vice GM/Director, China Hualu Group Co., Ltd.
|
| 17:05-17:30 |
Semiconductor Industry Trends from a Financial Perspective
—Mr. Tammy Kiely, VP/Head of Global Semiconductor Investment Banking, Goldman, Sachs & Co,
|
| 18:00-20:30 |
欢迎晚宴（Synopsys公司赞助）
Welcome Dinner Banquet (Sponsored by Synopsys)
|
|
| |
| |
|
2007年10月12日，星期五
Oct.12nd, Friday
|
|
专题论坛 （一）
Subject Forum (Ⅰ)
|
|
地点：大连香洲花园酒店三楼百合厅
Site:Lily Hall (Ⅰ)，3rd FL, Dalian Sweetland Hotel
|
| |
|
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
EDA软件、IC设计、IP复用、MPW与设计服务
EDA Software, IC Design, IP Reuse, MPW and Design Service
|
|
主持人：国家集成电路设计西安产业化基地主任蔺建文先生
Moderator: Mr. Lin Jianwen, Director of National IC Design Base Xi’an ICC
|
| 08:30-09:00 |
基于ZSP的音视频SoC平台
ZSP based Audio and Video SoC platform
|
张劲松先生，芯原微电子（北京）有限公司系统工程副总裁
Jensen Zhang, VP of System Engineering，VeriSilicon Microelectronics (Beijing) Co. Ltd.
|
| 09:00-09:30 |
SoC设计的最新挑战和解决方案
The new challenges and
solutions for SoC design
|
孙义先生，Synopsys公司资深工程师
Sun Yi, Senior Engineer, Synopsys
|
| 09:30-10:00 |
纵观Mentor Graphics一流的SoC解决方案
Mentor Graphics first-Class SoC solutions overview
|
牛风举先生，Mentor Graphics公司资深技术专家
Niu Fengju, Senior Technical Expert, Mentor Graphics
|
| 10:00-10:30 |
引领潮流的设计技术
Ahead of the curve technology
|
印燕女士，Magma中国上海区技术经理
Yin Yan，Technical Manager,
Magma Shanghai
|
| 10:30-11:00 |
设计驱动版图：可以预期的10倍速效率
Design Driven Layout Methodology
—10x Productivity You could Expect
|
郑珠田先生,SpringSoft大中国区销售总监
David Cheng, Sales Director,
Springsoft Great China
|
| 11:00-11:30 |
纳米SoC设计挑战-纳米低功耗与可制造性设计技术
Nanometer SoC Design Challenges
|
谢仲辉先生，Cadence公司亚太区平台销售总监
Felix Cha, Platform Sales
Director, Cadence
|
| 11:30-12:00 |
九天EDA工具在模拟电路设计中的应用Panda EDA system Zeni IC design tools application in Analog IC design
|
李琳先生，北京中电华大电子设计有限责任公司EDA事业部副总经理
Li Lin, Vice GM, EDA Department,
CEC Huada Electronic Design Co., Ltd.
|
| 12:00-13:30 |
自助午餐Buffet Lunch |
|
主持人：国家软件与集成电路公共服务平台主任 邱善勤博士
Moderator: Dr. Qiu Shanqin, Director of MII CSIP (Software and IC Promotion Center)
|
| 13:30-14:00 |
无线传感器网络节点技术发展趋势
The development trend of
wireless sensor net node technology
|
于宏毅博士，大连环宇阳光集团公司
Dr. Yu Hongyi, Dalian Huanyu
Group Co., Ltd.
|
| 14:00-14:30 |
授之于“艺”，授之于“技”，授之于“具”，教之创“芯”--《集成电路设计技术与工具》编著理念与实践
Teaching technologies,
techniques, and IC design EDA
tools, guiding to create chips--The thought & practice in
writing "Techniques & Tools of
IC Design" Textbook
|
王志功先生，东南大学射频与光电集成电路研究所教授
Prof.Wang Zhigong,Director, Institute of RF- & OE-ICs, Chief Prof./Chair Circuits and Systems, Southeast University
|
| 14:30-15:00 |
应用整合－智能存储集成电路发展的核心驱动力
Application conformity—core
driving power for smart memory IC development
|
杨延辉先生，凤凰微电子（中国）有限公司技术总监
Yang Yanhui, CTO, Phoenix
Microelectronics Co., Ltd.
|
| 15:00-15:30 |
绿色引擎技术在AC/DC电源的应用GreenEngineTM Technology in AC/DC Power Application
|
赵时峰先生，昂宝电子（上海）有限公司运营副总裁
Andy Zhao, COO, On-Bright
Electronics (Shanghai) Co., Ltd.
|
| 15:30-16:00 |
高性能混合信号集成电路设计的关键问题
Key problems in high-performance mixed signal IC design
|
向毅海先生，北京昆腾微电子有限公司
CEO Xiang Yihai, CEO, KT Micro Inc.
|
| 16:00-16:30 |
管理软件助力IC产品创新—DOIT设计数据管理系统
Management software promotes IC production innovation - DOIT design data management system
|
高英凯先生，领时科技（北京）有限公司运营总监
Gao Yingkai, COO, Top Era Technology Inc.
|
| 16:30-17:00 |
Foremost global forum about IC design innovation for
enterprise application systems |
Mr. Takayuki Kawahara, FE Vice Chair of ISSCC |
| 17:00-17:30 |
交流、参观展览Communication, Exhibition Visit |
| 18:00-20:00 |
大连市政府招待晚宴
Dalian Municipal Government Reception Dinner
|
|
| |
| |
|
2007年10月12日，星期五
Oct.12nd, Friday
|
|
专题论坛 （二）
Subject Forum (Ⅱ)
|
|
地点：大连香洲花园酒店三楼槐花厅南厅
Site: Scholar-tree-flower Hall (S)，3rd FL, Dalian Sweetland Hotel
|
| |
|
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
FOUNDRY、测试、封装与工艺技术
Foundry, Test, Packaging and Process Technology
|
|
主持人：中国半导体行业协会集成电路设计分会副秘书长王志华教授
Moderator: Prof. Wang Zhihua, Vice General Secretary of CSIA-ICCAD
|
| 08:30-09:00 |
通过合作攻克设计挑战
Solving design challenges through partnership
|
吴裕群先生，TSMC公司中国区副总经理
Wu Yuqun, China Vice GM, TSMC
|
| 09:00-09:30 |
CSMC BCD工艺基础上的功率/电源管理IC设计
Power/PMU IC Design based on CSMC BCDMOS Process
|
吴孝嘉先生，华润上华科技有限公司技术开发处资深处长
Filian Wu, Sr. Director of TD, CSMC Technologies Corporation |
| 09:30-10:00 |
凸版技术设计中心
Toppan Technical Design Centre
|
Chen Rukang，凸版技术设计中心有限公司FUKUOKA 设计中心，中国事务渠道工程师
Chen Rukang,China duties Bridge Engineer, Toppan Technical Design Centre Co., Ltd, FUKUOKA Design Centre
|
| 10:00-10:30 |
电路设计中的激光修调考量--在线离线
On-Line vs. Off Line Laser
Trimming Processes
|
王迎松博士，GSI集团中国销售经理
Jason Wang, China Sales Manager, GSI Group Inc.
|
| 10:30-11:00 |
柔性制造---IC测试
Flexible manufacturing---IC testing
|
朱煜珂先生，无锡华润安盛科技有限公司测试营运总监
Raymond Zhu, Testing COO, Wuxi China Resources Micro-assembly Technology Co., Ltd
|
| 11:00-11:30 |
下一代开放式架构测试解决方案
Next generation open architecture testing solution
|
浜岛明，爱德万测试（苏州）有限公司测试技术顾问
Akira Hamajima, Testing Technical Consultant, Advantest (SuZhou) Co., Ltd.
|
| 11:30-12:00 |
小批量封装测试服务加速IC设计企业产品上市时间
Small batch of packaging & testing services to quicken up Time to Market for IC design house products
|
梁峰先生，上海泰芯科技发展有限公司CTO
Forrest Liang, CTO, Shanghai Testchip Science & Technology Co., Ltd.
|
| 12:00-13:30 |
自助午餐Buffet Lunch |
|
资本与创业专题
Capital for Business Start-ups
|
|
主持人：美国新思科技中国区董事总经理 潘建岳先生
Moderator:Mr. Pan Jianyue, Director & China GM, Synopsys
|
| 14:00-16:00 |
本专题论坛将采取特邀嘉宾讨论和观众提问相结合的方式，探讨初创型集成电路设计企业面临的资金、产品、市场和管理难题和解决途径。通过嘉宾和观众的互动形成自由、轻松的交流氛围，对企业的产品选型、融资渠道、市场运作和运营管理等问题进行深入的讨论和交流。
Format: Q & A among VIPs and audience, to discuss on capital, products, markets and management difficulties IC Design start-ups face and solutions to the problems. Through mutual participation to create a free and relaxed communication environment. To warmly and deeply discuss on topics including product selection, financing channels, marketing operation and operation management, etc.
|
| 16:00-17:30 |
交流、参观展览Communication, Exhibition Visit |
| 18:00-20:00 |
大连市政府招待晚宴
Dalian Municipal Government Reception Dinner
|
|
| |
| |
|
2007年10月12日，星期五
Oct.12nd, Friday
|
|
专题论坛（三）
Subject Forum (Ⅲ)
|
|
地点：大连香洲花园酒店三楼槐花厅北厅
Site: Scholar-tree-flower Hall (N)，3rd FL, Dalian Sweetland Hotel
|
|
时 间
Time
|
内 容
Contents
|
演讲人
Lecturer
|
|
IP核标准与SoC设计实现
IP Core Standard and SoC Design Realization
|
|
主持人：信息产业部软件与集成电路促进中心主任助理 谢学军博士
Moderator: Dr. Xie Xuejun, Director Assistant of MII – CSIP
|
| 09:00-09:50 |
IP核标准介绍
IP core standard introduction
|
肖立伊女士,哈尔滨工业大学教授
Xiao Liyi, Prof. Harbin Institute of Technology
|
| 09:50-10:10 |
IP的第三方评测技术
IP third-party evaluating technology
|
孟德刚先生，信息产业部软件与集成电路促进中心项目经理
Meng Degang, PM, CSIP
|
| 10:10-10:30 |
硬IP核的Foundry设计规范
Foundry design criterion of hardware IP core
|
Robert Bai先生，中芯国际集成电路制造有限公司资深经理
Robert Bai, Senior Manager, SMIC
|
| 10:30-10:50 |
“龙芯”IP核的设计与IP服务模式
"Long-xin” IP core design and IP service mode
|
曾明先生，神州龙芯集成电路设计有限公司总裁
Zengming, President, BLX IC Design Co., Ltd
|
| 10:50-11:10 |
基于ZSP的可扩展平台方案
Extensible platform solution based on ZSP
|
汪洋先生，芯原微电子（北京）有限公司应用支持总监
Leo Wang, Application Engineering Director, VeriSilicon Microelectronics (Beijing) Co. Ltd.
|
| 11:10-11:30 |
基于智原CPU核设计您的高性能SoC芯片
To design your high-performance SoC based on Faraday CPU core
|
陈宏铭先生, 智原科技中国有限公司中国区IP业务部经理
Chen Hongming, China IP Manager, Faraday Technology Corporation
|
| 11:30-11:50 |
看中外知识产权纠纷 谈技术标准与专利
Talk on technology standard and patent from the point of viewing China and abroad IP cases
|
常亮先生，苏州市集成电路行业协会秘书长
Chang Liang, General Secretary, Suzhou IC Industry Association
|
| 11:50-12:00 |
互动问答Q&A |
| 12:00-13:30 |
自助午餐Buffet Lunch |
|
| |
|
|
| |
|
|
|
 |
|
|
| |
|
